This is part four of my observations from the JPCA Show.
Many vendors and manufacturers featured test equipment for flexible circuits. It was worth wile for me to take a long look at this equipment that evaluates new functional flexible circuits.
The first piece of equipment I examined was a flexing endurance tester presented by YUASA SYSTEMS (the company has no relation with the major battery manufacturer).
Previously, circuit manufacture engineers developed specific test equipment for flexing tests because there was no system available for testing. Machine manufacturers viewed this segment as a niche, and decided that a limited market was not profitable. This could change. New demands in wearable electronics now include flexing modes such as twisting and stretching. The new test machines are capable in conducting ten kinds of flexing changes.
The second examples of test machines include a migration tester. In a previous newsletter, I wrote about silver migration from thick film circuits and the headache this causes for the industry. Unfortunately, most circuit manufacturers don’t have suitable test equipment, and thick film circuit manufacturers do not provide reliable numerical test data for their customers. The migration tester provides an insulation tester with moisture chamber, and circuit manufacturers can now provide reliability data for their customers.
The most radical piece of test equipment I viewed at the show was geared toward the furniture industry. This equipment is a large sized pressure sensor array produced for bed and sofa furniture designers. The two kinds of pressure sensors include a Piezo type and a static capacitance type. The sensor module consistently measures pressure distribution. The circuits are built on a fabric material, placed between a sheet and mattress, and are required to have moisture permeability and elasticity. The manufacturer of the device is a flex circuit manufacturer, and one of their engineers explained that they did not need to invest in any extra processes, and completed the manufacturing utilizing the current facilities.
Dominique K. Numakura, email@example.com
DKN Research, www.dknresearch.com
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Headlines of the week
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- Murata (Major device supplier in Japan) 7/16
Has started the volume production of the world smallest SAW components series for the multi-band mobile equipment. Chip size: 0.9 x 0.7 mm.
- Sony (Major electronics company in Japan) 7/30
Has released Q1 performance. Revenue dropped 1.4% by y/y to 1926 billion yens. Net income has dropped 33% to 152 billion yens. CMOS sensor business was quite busy.
- Kyushu University (Japan) 8/2
Has developed a new type of organic EL with high quantum yield up to 40%. It will reduce the cost because it does not need keep organic layer very thin.
- TSMC (Major semiconductor manufacturer in Taiwan) 8/2
Will hire another 3000 employees in Taiwan in spite of slow market. It will invest over 11 billion US dollars in 2019.
- Showa Denko (Major chemical company in Japan) 8/5
Has developed a new high quality 6” SiC Wafer for power semiconductor devices. The defect density became half.
- Renesas (Major semiconductor manufacture in Japan) 8/6
Has release Q2 performance. Revenue dropped 5.3% by y/y to 192.6 billion yens. The production in August will be reduced for the balance of inventories.
- Murata (Major device supplier in Japan) 8/5
Has decided additional investment of 4.71 billion yen to expand the manufacturing capacity of MLCC (multi-layer ceramic capacitor). New plant will be built in Iwami.
- TIT (Technical Institute in Japan) 8/6
Has developed a new perovskite type LED with halogen molecule. It has a higher brightness at low voltage drive.
- Tohoku University (Japan) 8/6
Has succeeded to measure IQE of perovskite type organic/inorganic hybrid semiconductor, CH3NH3PbBr3. It depends on the amount of CH3NH3.
- Mitsubishi Electric (Major electric & electronics company in Japan) 8/7
Has developed a new thermal diode IR image sensor “MelDIR” with small package (19.5 x 13.5 x 9.5 mm) for security camera. It detects 0.1 degree C changes.
- Toshiba Memory (Major semiconductor manufacturer in Japan) 8/8
Has developed a new compact size (14 x 18 x 1.4 mm) removable PCle/NVMe memory “XFMEXPRESSS” for the ultra mobile devices.
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